Events

Past Event

Power converters for servers and data centers

November 22, 2019
2:00 PM - 3:00 PM
Dr. Xin Zhang, IBM

Speaker: Dr. Xin Zhang, IBM

Abstract:
Due to the explosive growth of cloud and AI computing, servers and data centers are increasingly consuming more electrical power, when high performance CPUs and GPUs are demanding ever-increasing power density. How to deliver power from the wall plug to silicon cores has become a critical question for the emerging computing systems. In this talk, we will start with overview of power delivery architectures in servers, and then move on to advanced power delivery techniques. The talk will also discuss the advantages and practical considerations of the different approaches, and some state-of-the-art converter examples.

 

Biography:
Xin Zhang is a research staff member at IBM T. J. Watson Research Center, Yorktown Heights, NY, where he has been working on power converters and packaging solutions for servers and HPC systems since 2014. Before joining IBM, he was with the Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), Singapore, as a scientist. And before that, he was with Institute of Industrial Science, University of Tokyo, Tokyo, Japan, as a researcher. In 2012, he was a visiting scholar at the University of California Berkeley. He received the B.S. degree in electronics engineering from Xi’an Jiaotong University, Xi’an, China, in 2003, and the Ph.D. degree in microelectronics from Peking University, Beijing, China, in 2008. Dr. Zhang has authored or co-authored over 40 technical papers and a number of patents. His research interests include analog circuits, power devices and converters, magnetics and emerging computer system architecture. He has served as guest editors for IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) and IEEE Solid State Circuits Letters (SSC-L). He is a Senior Member of IEEE. He is a TPC member for IEEE VLSI Symposium on Circuits and Applied Power Electronics Conference (APEC).