Engineering Students Visit NXP's IC Fab in Fishkill, NY
May 02, 2008
Columbia University's Student IEEE chapter organized a trip to NXP's 200mm integrated circuits (IC) fabrication facility in Fishkill, NY, as part of an ongoing effort to make engineers at Columbia aware of the varied career opportunities open to them, and give them a sense of what industry level fabrication facilities are like. Students on the tour were able to go into a class 10 clean room at the facility, and observe all the aspects of IC fabrication, from the photolithography stage to the automated reactive ion etch (RIE) and wet etch stations to the analysis, characterization and packaging units. NXP's division at Fishkill focuses on +250nm features for applications in the area of RF and power management, and more recently, solid state lighting.