Research focus

Our research interest lies in computing hardware and VLSI circuits with the foci given to energy-efficiency, artificial intelligence and machine learning, and hardware security.

Algorithm Hardware Co-Design for AI/ML, DSP, Comm


Create new algorithm and hardware together to minimize resource use for neural networks, deep learning, digital signal processing (DSP), and wireless communication.

  • Deep learning based channel estimation processor for 5G millimeter-wave communication systems: TCASI21

  • Sub-microwatt keyword spotting hardware based on depth-separable convolution neural networks: ISSCC20

  • Memory-efficient neural network architecture search (NAS): ArXiv19, CVPR20

  • KTAN: Knowledge Transfer Adversarial Network: IJCNN20

  • FPGA based deep learning accelerator: ISLPED19

  • High-capacity fingerprint recognition system based on dynamic capacity estimation of associative memory: Arxiv17, Biocas18

  • Recursive synaptic bit reuse for associative memory: DATE17, TVLSI18

  • Recursive binary neural network training model: TCASI19

  • Nanowatt 96-channel brain-computer-interface processor, Neural Spike Processor, for motor-intention decoding: DATE17, ESSCIRC18

  • Spike sorter hardware with Bayesian unsupervised learning: VLSI16 TVLSI19

  • Informative screening in unsupervised learning for spike sorting: DAC15

  • Energy- and area-efficient FFT processor: ISSCC11, JSSC12, ESSCIRC17

In-Memory Computing (IMC) SRAM Circuits and Architecture


Create novel in and near memory computing architecture for SRAM, DRAM, and NVM. Breaking the memory wall in Von Neumann architecture and also bypassing row-by-row memory access toward single-cycle vector-matrix dot product.

  • DIMC, digital in-memory computing SRAM based on approximate arithmetic: ISSCC22

  • MBIMC, analog-mixed-signal in-memory computing SRAM supporting multi-bit weights and inputs: CICC22

  • C3SRAM, in-memory computing SRAM based on the capacitive coupling mechanism: ESSCIRC19, JSSC20, DATE21, DAC21, DNT21

  • A deep neural network accelerator featuring in-memory computing SRAM: Vesti: TVLSI19, Asiloma19; PIMCA: VLSI21

  • k-nearest neighbor accelerator using in-memory-computing (IMC) SRAM: ISLPED19

  • XNOR-SRAM, in-memory computing SRAM based on the resistive computing mechanism, achieving over 400 TOPS/W and 5 TOPS/mm2 for a vector-matrix dot product in a 65-nm CMOS: VLSI18, GLSVLSI19, JSSC19

Bio-Inspired Neuromorphic Hardware


Build better machine-learning hardware with the insights from the nature. Artificial cochlear, spiking neural networks, unsupervised learning, and so on.

  • Sub-microwatt end-to-end keyword spotting chip with the background noise robustness: ISSCC21, JSSC21

  • Sub-300-nanowatt always-on spiking neural network: ASSCC20, FIN21

  • 1-Microwatt voice activity detection chip: ISSCC18, JSSC19

  • Energy-efficient neuromorphic classifiers on a SNN chip: NECO16

  • Neuromorphic processor featuring online learning: ISLPED15, VLSI-SOC15, VLSI16, TVLSI19

Ultra-Low-Power Near/Sub-Threshold Digital Processor


Create the sub-milliwatt and sub-microwatt digital processors via circuit and architecture innovations.

  • Metastability error detection and correction (MEDAC): ISSCC20, JSSC21

  • CATENA, a sub-0.4-mW 16-core spatial arracy processor (aka coarse-grained reconfigurable array, CGRA): VLSI19, JSSC20

  • Accelerator architecture: homogeneous vs. heterogeneous: ISCA19

  • Triggered processing element design: Micro17, Github

  • Saving leakage in a multi-core processor in NTV: TVLSI16, S3S13

  • Feedforward leakage self-suppression (FLSL) logic family: SSCL19, MWSCAS19, ISCAS21, ISCAS21

  • Wide-pulsed-latch pipelining for near threshold voltage processors JSSC17

  • Body-swapping error correction for non-Von-Neumann architecture VLSI16, TVLSI19

  • Sparse error detection technique: TVLSI16

  • Near Threshold Voltage Razor (EDAC): JSSC15

  • Regenerator based interconnect and clock networks: ISLPED14

  • Energy- and area-efficient FFT processor: ISSCC11, JSSC12, ESSCIRC17

  • Pipeline methodology for NTV processors: DAC11

  • Cubic-millimeter wireless sensor: ISSCC11

  • Femtowatt SRAM: ISCAS11

  • Clock network design for NTV and STV circuits: ISLPED10

  • Millimeter-scale sensor system: ISSCC10

  • Energy-optimal technology selection: ISLPED09

  • Near-threshold ROM design: CICC08

  • Power gating for nanowatt processors: TVLSI11, ESSCIRC08

  • Phoenix processor: VLSI08, JSSC09

Integrated Voltage Regulators for Next-Generation SoCs


Create smaller, power-efficient voltage regulators, DC-DC converters, and harvesting power converters.

  • Digital LDO for an AMS load: SSCL20

  • Single-inductor multiple-output (SIMO) DC-DC converters for ultra-low power SoCs: SSCL21

  • 48V-to-0.75V DC-DC converter for data-center application: ECCE20

  • Multi LDO systems with distributed event-driven control: VLSI19, JSSC21

  • BTWC sizing of a switched-capacitor DC-DC converter: ISLPED18

  • Synchronous and asynchronous comparator circuits: ISLPED17

  • Digital LDO based on event-driven control: ISSCC16, ISSCC17, VLSI18, SSCL18

  • Tripple-mode energy harvesting DC-DC converter: JSSC17

  • Hybrid switched-capacitor and LDO DC-DC converter: VLSI09

  • Picowatt 2-transistor voltage reference (2T-Vref): JSSC12

Hardware Security


Hardware X Security

  • Detection-driven protection of physical attack: VLSI21

  • Ultra-compact and robust PUF based on analog circuits: JSSC16

  • Technique to transform SRAM to analog PUF: JSSC18

  • Machine-learning based blacklisting against CLKSCREW attacks: ISLPED18

  • High energy-efficiency AES accelerator: VLSI19

Hybrid Analog Digital Computing for Differential Equation Solution


Revive analog computing for scientific computing.

  • Hybrid analog digital computer chip in a 65 nm process: ESSCIRC15, JSSC16, Spectrum18

  • Solving linear algebra problems in the hybrid analog digital computer: ISCA16

  • Solving nonlinear partial differential equations in the hybrid analog digital computer: Micro17

Thermal and Reliability Management


Explore new thermal sensors, aging sensors, and related hardware and software stacks for dynamic management.