Date: Friday, February 15
Location: EE Conference Room (Mudd 1306)
Speaker: Prof. Sung Woo Chung, Professor & Department Chair, Korea University
Faculty host: Prof. Mingoo Seok
Abstract: This talk consists of two parts: 1) thermal modeling and 2) power/thermal management. In the first part, we will present the practical thermal modeling techniques based on HotSpot, which we validated against a commercial application processor. In the second part, we will present the software-level power/thermal management techniques, which are not only easy to understand but also adopted by the industry. These techniques were also validated in the commercial smartphones.
Bio: Sung Woo Chung received the BS, MS, and Ph.D. degrees in Electrical Engineering and Computer Science from Seoul National University, in 1996, 1998, and 2003, respectively. He was a senior engineer in Samsung Electronics from 2003 to 2004. In 2005, He was a research scientist at the University of Virginia. Since 2006, he is a professor in the Department of Computer Science, Korea University, Seoul, Korea. His research interests include low-power design, temperature-aware design, and user-aware design. He was an Associate Editor of IEEE Transactions on Computers from 2010 to 2015. He was the Technical Program Co-Chair of the IEEE International Conference on Computer Design in 2015. He serves (and served) on the technical program committees in many conferences, including Design Automation Conference (2015-2018), International Symposium on Low Power Electronics and Design (2016-2019), and International Parallel and Distributed Processing Symposium (2017-2018). He is a senior member of IEEE.